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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE, ASSEMBLY, AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2016/031206
Kind Code:
A1
Abstract:
This semiconductor device comprises: a metal plate capacitor including a heat-resistant metal plate, and a capacitor part that includes a sintered dielectric formed on at least one surface of the heat-resistant metal plate; a semiconductor chip arranged so as to overlap the metal plate capacitor; a connection part that electrically connects the semiconductor chip and the metal plate capacitor; and a protection part that protects the semiconductor chip, the metal plate capacitor, and the connection part.

Inventors:
KATSUMURA, Hidenori
TOKUNAGA, Shinya
SUMITA, Masaya
YOSHIDA, Hiroyoshi
SUGAYA, Yasuhiro
URIU, Kazuhide
SHIBATA, Osamu
Application Number:
JP2015/004191
Publication Date:
March 03, 2016
Filing Date:
August 21, 2015
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
H01L25/00; H01G4/12
Foreign References:
JPH05267557A1993-10-15
JP2006191110A2006-07-20
JPS61102770A1986-05-21
JPS634662A1988-01-09
JP2011519472A2011-07-07
JPH1126290A1999-01-29
JPH05335501A1993-12-17
JP2006019596A2006-01-19
JP2010157529A2010-07-15
US5498901A1996-03-12
Attorney, Agent or Firm:
FUJII, Kentaro et al. (1-61, Shiromi 2-chome, Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
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