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Title:
SEMICONDUCTOR DEVICE, BUILT-IN CAPACITOR UNIT, SEMICONDUCTOR-MOUNTING BODY, AND METHOD FOR MANUFACTURING BUILT-IN CAPACITOR UNIT
Document Type and Number:
WIPO Patent Application WO/2015/182114
Kind Code:
A1
Abstract:
 The present invention reduces jitter, which is a problem in a semiconductor component for processing signals at high speed. A semiconductor device having: a heat-resistant metallic plate; a capacitor part that is formed on one or more sides of the heat-resistant metallic plate and has a lower electrode, a sintered dielectric part, and an upper electrode; a semiconductor chip fixed on the capacitor part; a lead frame; wires electrically connected to the semiconductor chip and/or the upper electrode; and a mold part into which at least the capacitor part and the semiconductor chip will be buried, wherein the semiconductor chip, the electrodes, the metallic plate, etc., are electrically connected via first, second, and third wires.

Inventors:
SUGAYA YASUHIRO
KATSUMURA HIDENORI
TOKUNAGA SHINYA
Application Number:
PCT/JP2015/002639
Publication Date:
December 03, 2015
Filing Date:
May 26, 2015
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L25/00; H01G4/228; H01G4/33; H01L21/60
Foreign References:
JPH05267557A1993-10-15
JP2006191110A2006-07-20
JPS61102770A1986-05-21
JP2010157529A2010-07-15
JPH1126290A1999-01-29
JPH02187054A1990-07-23
JP2006019596A2006-01-19
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
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