SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2024/016606

A1

A semiconductor device, a communication apparatus and a manufacturing method therefor. The semiconductor device comprises: a first functional module, provided on a first substrate (100), and comprising a chip (101), an electrical connection assembly unit (103) and a sealing ring (102), the sealing ring (102) surrounding the periphery of the chip (101), and the chip (101) being electrically connected to the electrical connection assembly unit (103); a second functional module, comprising a packaging substrate (200), the packaging substrate (200) comprising at least two metal layers (201) and a dielectric layer (202) between the metal layers (201); a third functional module, comprising a plurality of redistribution lines (302) and a plurality of micro-vias (303), and used for implementing electrical connection between the first functional module and the second functional module; and a second substrate (400), the second substrate (400) and the first substrate (100) being sealingly arranged, wherein at least two redistribution lines (3021, 3022) in the plurality of redistribution lines (302) intersect each other, and at least one micro-via (3031) in the plurality of micro-vias (303) is electrically connected to the second functional module by means of the at least two different redistribution lines (3021, 3022).

LIU HAIRUI (CN)
LAI ZHIGUO (CN)
YANG QINGHUA (CN)

PCT/CN2022/143495

January 25, 2024

December 29, 2022

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SUZHOU HUNTERSUN ELECTRONICS CO LTD (CN)

H03H9/54; H03H3/02

CN115021711A	2022-09-06
CN114465601A	2022-05-10
CN110504942A	2019-11-26
CN102067447A	2011-05-18
CN112599532A	2021-04-02
JP2011071256A	2011-04-07
US20130321102A1	2013-12-05

HOPEMICRO INTELLECTUAL PROPERTY FIRM (CN)

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