Title:
SEMICONDUCTOR DEVICE AND COMPOSITE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/065113
Kind Code:
A1
Abstract:
A semiconductor device 100 according to one embodiment of the present invention is provided with a semiconductor substrate 11 and a protective layer 20. The semiconductor substrate 11 has a first surface that constitutes a circuit surface, and a second surface that is on the reverse side of the first surface. The protective layer 20 is configured of a single layer of a composite material containing soft magnetic particles, and has a bonding surface 201 that is bonded to the second surface.
Inventors:
OKAMOTO NAOYA (JP)
MATSUSHITA TAIGA (JP)
MATSUSHITA KAORI (JP)
MATSUSHITA TAIGA (JP)
MATSUSHITA KAORI (JP)
Application Number:
PCT/JP2016/079997
Publication Date:
April 20, 2017
Filing Date:
October 07, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L23/00; B32B7/06; C09J7/22; C09J11/04; C09J201/00; H01L21/301; H01L21/60; H01L23/29; H01L23/31
Foreign References:
| JP2013021628A | 2013-01-31 | |||
| JP2012044084A | 2012-03-01 | |||
| JP2012119688A | 2012-06-21 | |||
| JP2012124466A | 2012-06-28 | |||
| JPH03151658A | 1991-06-27 | |||
| JP2000114440A | 2000-04-21 | |||
| JP2002158488A | 2002-05-31 | |||
| JP2005235944A | 2005-09-02 | |||
| JP2006140348A | 2006-06-01 | |||
| JP2000133986A | 2000-05-12 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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