Title:
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138443
Kind Code:
A1
Abstract:
The present invention provides a display device in which a third bump group that prevents malfunctions due to the warpage of a semiconductor device and performs another function is provided between a first bump group and a second bump group on the semiconductor device, and in which the size of the bezel has been decreased. A semiconductor device according to the present invention comprises: a first bump group including a plurality of first bumps aligned in the long-side direction; a second bump group including a plurality of second bumps aligned in the long-side direction; and a third bump group between the first bump group and the second bump group. In at least one of the positions facing a plurality of third bumps in the short-side direction, which is perpendicular to the long-side direction, on the surface of the semiconductor device that is mounted to the display device, either no second bump is present, or at least one second bump is present and the at least one second bump is a dummy bump.
Inventors:
MURAKAMI SHINZOH
SHIMIZU YUKIO
HORIGUCHI TAKESHI
SHIMIZU YUKIO
HORIGUCHI TAKESHI
Application Number:
PCT/JP2017/003893
Publication Date:
August 17, 2017
Filing Date:
February 03, 2017
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
G09F9/00; G02F1/133; H01L21/60; H01L51/50; H05B33/06; H05B33/12
Domestic Patent References:
| WO2014057908A1 | 2014-04-17 | |||
| WO2007039960A1 | 2007-04-12 |
Foreign References:
| JP2014239164A | 2014-12-18 | |||
| JP2007019388A | 2007-01-25 | |||
| US20090268147A1 | 2009-10-29 | |||
| US20070138654A1 | 2007-06-21 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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