SEMICONDUCTOR DEVICE, DYNAMIC QUANTITY MEASURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Title:

SEMICONDUCTOR DEVICE, DYNAMIC QUANTITY MEASURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/006840

Kind Code:

A1

Abstract:

This semiconductor device is provided with: a metal body; a bonding layer arranged on the metal body; and a semiconductor chip arranged on the bonding layer. The bonding layer comprises: a first layer that is formed between the metal body and the semiconductor chip and contains a filler; and a second layer that is bonded to the first layer and the semiconductor chip and has a higher thermal expansion coefficient than the first layer.

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Inventors:

SHIMOKAWA HANAE (JP)
ISHIHARA SHOSAKU (JP)
SOMA ATSUO (JP)
ONOZUKA JUNJI (JP)
ONUKI HIROSHI (JP)
TERADA DAISUKE (JP)
SHIBATA MIZUKI (JP)

Application Number:

PCT/JP2016/069521

Publication Date:

January 12, 2017

Filing Date:

June 30, 2016

Export Citation:

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Assignee:

HITACHI AUTOMOTIVE SYSTEMS LTD (JP)

International Classes:

G01L9/00; G01B7/16; H01L29/84

Foreign References:

JPH0711461B2	1995-02-08
JP2013234955A	2013-11-21

Other References: