Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/261093
Kind Code:
A1
Abstract:
Provided is a semiconductor device capable of achieving high detection efficiency and low jitter without depending on the thickening of a substrate. The semiconductor device comprises a plurality of pixels each having formed therein an avalanche photodiode element that photoelectrically converts incident light, wherein each of the plurality of pixels includes a substrate that includes a first semiconductor material and a lamination part that is laminated on a light incident-side surface of the substrate and includes a second semiconductor material that is different from the first semiconductor material.
Inventors:
SHIMADA SHOHEI (JP)
OTAKE YUSUKE (JP)
WAKANO TOSHIFUMI (JP)
OTAKE YUSUKE (JP)
WAKANO TOSHIFUMI (JP)
Application Number:
PCT/JP2021/017542
Publication Date:
December 30, 2021
Filing Date:
May 07, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L31/107; H01L27/146; H04N5/374
Domestic Patent References:
| WO2017163559A1 | 2017-09-28 | |||
| WO2017130723A1 | 2017-08-03 | |||
| WO2015001987A1 | 2015-01-08 |
Foreign References:
| JP2008500723A | 2008-01-10 | |||
| JP2011146635A | 2011-07-28 | |||
| JP2001007381A | 2001-01-12 | |||
| JP2019140132A | 2019-08-22 | |||
| JP2012004443A | 2012-01-05 | |||
| JP2006245088A | 2006-09-14 | |||
| JPH06243795A | 1994-09-02 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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