Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2018/139282
Kind Code:
A1
Abstract:
The present art pertains to a semiconductor device with which it is possible to provide an optical system that is stable with respect to heat, and an electronic instrument. Provided is a semiconductor device equipped with a sensor and a holding substrate for holding the sensor, the semiconductor device satisfying the relationships (EI × tI) + (ES × tS) > 30 and 1.5 < CTEI < 4.5, where, regarding the sensor, ES(GPa) represents the Young's modulus and tS(mm) represents the thickness, and regarding the holding substrate, CTEI(ppm/K) represents the linear coefficient, EI(GPa) represents the Young's modulus, and tI(mm) represents the thickness. The present art can be applied to, e.g., a semiconductor package housing an image sensor.
Inventors:
HOGYOKU SUSUMU (JP)
Application Number:
PCT/JP2018/001091
Publication Date:
August 02, 2018
Filing Date:
January 17, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B7/02; G03B17/02; H04N5/369
Domestic Patent References:
| WO2017010063A1 | 2017-01-19 |
Foreign References:
| JP2000269472A | 2000-09-29 | |||
| JP2015046438A | 2015-03-12 | |||
| JP2014194541A | 2014-10-09 | |||
| JP2014229674A | 2014-12-08 | |||
| JP2014216394A | 2014-11-17 | |||
| JP2012020892A | 2012-02-02 | |||
| JP2005005488A | 2005-01-06 | |||
| JP2008235869A | 2008-10-02 | |||
| US20100314703A1 | 2010-12-16 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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