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Title:
SEMICONDUCTOR DEVICE, ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/149983
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor device having further reduced size. [Solution] Disclosed is a semiconductor device that is provided with: a multilayer wiring board, one surface of which is provided with an external connection terminal; and a plurality of active components, which are provided inside of the multilayer wiring board by being stacked, and which are connected to the external connection terminal via a connection via. The active components include: a first active component that is provided on the other surface side, i.e., the reverse side of the one surface; and a second active component, which is provided on the side further toward the one surface than the first active component, and which has a planar area that is smaller than that of the first active component.

Inventors:
YASUKAWA HIROHISA (JP)
Application Number:
PCT/JP2017/001870
Publication Date:
September 08, 2017
Filing Date:
January 20, 2017
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
H01L25/065; H01L23/12; H01L23/14; H01L23/28; H01L25/07; H01L25/18; H05K1/02; H05K1/18; H05K3/46
Domestic Patent References:
WO2014185204A12014-11-20
Foreign References:
JP2006216770A2006-08-17
JP2009076833A2009-04-09
JP2004056093A2004-02-19
US20110084382A12011-04-14
JP2013069808A2013-04-18
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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