SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

WIPO Patent Application WO/2020/116040

A1

The present invention provides: a semiconductor device which has improved bondability between a first electrode part and a second electrode part facing each other; and an electronic device. A semiconductor device according to the present invention is provided with: a first wiring part; a first interlayer insulating film which covers one surface of the first wiring part; a first electrode part which is provided within a first through hole that is formed in the first interlayer insulating film, and which is electrically connected to the first wiring part; a second wiring part; a second interlayer insulating film which covers a surface of the second wiring part, said surface facing the first wiring part; and a second electrode part which is provided within a second through hole that is formed in the second interlayer insulating film, and which is electrically connected to the second wiring part. The first electrode part and the second electrode part are directly bonded to each other. The thermal expansion coefficient of the first electrode part is higher than the thermal expansion coefficient of the first wiring part.

JPS583381	[Title of the Invention] How to make wiring from one side of a supporting board to the upper and lower sides of a ground plane
JP4212905	Plating method and plating equipment used for this

HASHIGUCHI HIDETO (JP)

PCT/JP2019/041079

June 11, 2020

October 18, 2019

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SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

H01L21/3205; H01L21/768; H01L23/522; H01L27/00; H01L27/146; H04N5/369

JP2012204501A	2012-10-22
JP2018528622A	2018-09-27

TANAKA Hidetetsu et al. (JP)

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