Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/005916
Kind Code:
A1
Abstract:
This semiconductor device (100) comprises: a first semiconductor element (1) and a second semiconductor element (2) which have electrodes formed on both sides thereof and which are configured to be mountable on a wiring board having wiring; two first terminals (51, 52) arranged side by side in one direction; two second terminals (53, 54) arranged side by side in one direction; and a sealing resin section (7). The sealing resin section covers the first semiconductor element, the second semiconductor element, the first terminals, and the second terminals, in a state where one surface of the first terminals and the second terminals that faces the wiring board is exposed. Each one surface of the two first terminals has a different area ratio, and each one surface of the two second terminals has a different area ratio. One of the two first terminals is arranged adjacent to both of the two second terminals.
Inventors:
FUKATSU AKIHIRO (JP)
NAGASE NOBORU (JP)
NAGAYA TOSHIHIRO (JP)
NAGASE NOBORU (JP)
NAGAYA TOSHIHIRO (JP)
Application Number:
PCT/JP2020/021511
Publication Date:
January 14, 2021
Filing Date:
June 01, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/28; H01L21/60; H01L23/50; H01L25/07; H01L25/18; H02M7/48; H05K1/18
Foreign References:
| JP2016004796A | 2016-01-12 | |||
| JP2013089948A | 2013-05-13 | |||
| JP2018129414A | 2018-08-16 | |||
| JP2014029944A | 2014-02-13 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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