Title:
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME, AND LAMINATED FILM FOR FORMING SUPPORT PIECE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/218524
Kind Code:
A1
Abstract:
The laminated film for forming a support piece according to the present invention includes, in order, a base film, an adhesive layer, and a film for forming a support piece, wherein the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile elasticity of 8.0 MPa or more. This laminated film for forming a support piece is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip.
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Inventors:
YAHATA TATSUYA (JP)
TANIGUCHI KOHEI (JP)
HASHIMOTO SHINTARO (JP)
OZAKI YOSHINOBU (JP)
ITAGAKI KEI (JP)
TANIGUCHI KOHEI (JP)
HASHIMOTO SHINTARO (JP)
OZAKI YOSHINOBU (JP)
ITAGAKI KEI (JP)
Application Number:
PCT/JP2020/017729
Publication Date:
October 29, 2020
Filing Date:
April 24, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
| US7859119B1 | 2010-12-28 | |||
| JP2006005333A | 2006-01-05 | |||
| JP2014082498A | 2014-05-08 | |||
| JP2017515306A | 2017-06-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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