Title:
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/218526
Kind Code:
A1
Abstract:
A semiconductor device according to the present disclosure has a dolmen structure including: a substrate; a first chip disposed on the substrate; a plurality of support pieces arranged on the substrate and around the first chip; and a second chip supported by the plurality of support pieces and disposed to cover the first chip, wherein the support piece is made of a cured product of a thermosetting resin composition or includes a layer made of a cured product of the thermosetting resin composition and a resin layer or a metal layer.
Inventors:
YAHATA TATSUYA (JP)
TANIGUCHI KOHEI (JP)
HASHIMOTO SHINTARO (JP)
OZAKI YOSHINOBU (JP)
TANIGUCHI KOHEI (JP)
HASHIMOTO SHINTARO (JP)
OZAKI YOSHINOBU (JP)
Application Number:
PCT/JP2020/017731
Publication Date:
October 29, 2020
Filing Date:
April 24, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
| US7859119B1 | 2010-12-28 | |||
| JP2006005333A | 2006-01-05 | |||
| JP2003124433A | 2003-04-25 | |||
| JP2010206136A | 2010-09-16 | |||
| JP2017515306A | 2017-06-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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