SEMICONDUCTOR DEVICE HAVING MULTI-CHIP STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

Title:

SEMICONDUCTOR DEVICE HAVING MULTI-CHIP STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

Document Type and Number:

WIPO Patent Application WO/2018/080185

Kind Code:

A1

Abstract:

The present invention provides a semiconductor device having a multi-chip structure and a semiconductor module using the same. In the semiconductor device, unit chips, such as a source driver, may be configured in a multi-chip structure to enhance the packaging density of the unit chips, and the input pads and output pads of the unit chips may have identical or different structures to enhance the packaging density by various options.

Inventors:

LIM HUN YONG (KR)
JANG CHEOL SANG (KR)
KIM YONG MIN (KR)

Application Number:

PCT/KR2017/011893

Publication Date:

May 03, 2018

Filing Date:

October 26, 2017

Export Citation:

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Assignee:

SILICON WORKS CO LTD (KR)

International Classes:

H01L25/00; H01L21/76; H01L21/78; H01L23/12; H01L25/065; H01L25/11

Foreign References:

KR100392154B1	2003-07-22
JP2009260373A	2009-11-05
KR20110015201A	2011-02-15
KR20030007076A	2003-01-23
KR20110126991A	2011-11-24

Attorney, Agent or Firm:

LEE, Cheol Hee (KR)

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