Title:
SEMICONDUCTOR DEVICE HAVING SHIELD LAYER AND ELEMENT-SIDE POWER SUPPLY TERMINAL CAPACITIVELY COUPLED THEREIN
Document Type and Number:
WIPO Patent Application WO/2011/021328
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device which is provided with: a wiring board wherein a board-side power supply terminal and a board-side ground terminal are provided on a first surface; a semiconductor element, which is disposed on the first surface side of the wiring board, and is provided with a facing surface that is disposed at a position facing the first surface; a shield layer, which is provided so as to cover the outer surfaces of the semiconductor element other than the facing surface; an element-side power supply terminal, which is provided on the facing surface and is electrically connected to the board-side power supply terminal; an element-side ground terminal, which is provided on the facing surface, and is electrically connected to the board-side ground terminal and the shield layer; and a first capacitively coupling section which capacitively couples the shield layer and the element-side power supply terminal.
Inventors:
WAKABAYASHI YOSHIAKI (JP)
Application Number:
PCT/JP2010/003835
Publication Date:
February 24, 2011
Filing Date:
June 09, 2010
Export Citation:
Assignee:
NEC CORP (JP)
WAKABAYASHI YOSHIAKI (JP)
WAKABAYASHI YOSHIAKI (JP)
International Classes:
H01L23/12
Foreign References:
| JP2003347441A | 2003-12-05 |
Attorney, Agent or Firm:
TANAI, Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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