Title:
SEMICONDUCTOR DEVICE, IMAGE CAPTURE DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/146245
Kind Code:
A1
Abstract:
The purpose of the present invention is to prevent damage to a semiconductor package due to deformation of a member constituting the semiconductor package as a result of a temperature change. This semiconductor device is provided with a frame, a semiconductor chip, and a lid portion. The frame is configured from a bottom portion and a wall portion. The wall portion is disposed adjacent to the bottom portion, has an annular configuration, and includes an annular circumferentially continuous protrusion on an upper surface thereof. The semiconductor chip is mounted on the bottom portion surrounded by the wall portion. The lid portion is adhered to the frame on the upper surface.
Inventors:
ATAGO NOBUTAKA (JP)
Application Number:
PCT/JP2018/043650
Publication Date:
August 01, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/02; H01L23/08; H01L27/146; H04N5/335
Foreign References:
| JP2006332685A | 2006-12-07 | |||
| JPH10209314A | 1998-08-07 | |||
| JPH11111959A | 1999-04-23 | |||
| JP2005252223A | 2005-09-15 | |||
| JPS58127474A | 1983-07-29 | |||
| JP2006120753A | 2006-05-11 | |||
| JP2010067836A | 2010-03-25 | |||
| JP2004349463A | 2004-12-09 | |||
| JP2006066791A | 2006-03-09 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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