Title:
SEMICONDUCTOR DEVICE, IMAGE PICKUP DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/037667
Kind Code:
A1
Abstract:
[Problem] To provide: a semiconductor device wherein mechanical strength and reliability are maintained, while reducing inter-wiring capacitance by means of a gap; an image pickup device; and a method for manufacturing the semiconductor device.
[Solution] Disclosed is a semiconductor device that is provided with: a multilayer wiring layer, in which insulating layers and diffusion preventing layers are alternately laminated, and wiring is provided inside; a through hole, which is provided by penetrating one or more insulating layers from one surface of the multilayer wiring layer, and the inner side of which is covered with a protection side wall; and a gap that is provided in one or more insulating layers, said gap being provided directly under the through hole.
Inventors:
KAWASHIMA HIROYUKI (JP)
Application Number:
PCT/JP2017/021173
Publication Date:
March 01, 2018
Filing Date:
June 07, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/768; H01L21/308; H01L23/532
Domestic Patent References:
| WO2015025637A1 | 2015-02-26 |
Foreign References:
| JP2010062242A | 2010-03-18 | |||
| JP2010283307A | 2010-12-16 | |||
| JP2013084841A | 2013-05-09 | |||
| JPH0521617A | 1993-01-29 | |||
| US20080173976A1 | 2008-07-24 | |||
| JP2002353303A | 2002-12-06 | |||
| JP2002353304A | 2002-12-06 | |||
| JP2011233864A | 2011-11-17 |
Other References:
See also references of EP 3506342A4
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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