Title:
SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2016/143815
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device wherein a material to be bonded is bonded by means of a cured product of an adhesive that is suppressed in decrease of the bonding strength in a moisture resistance test after curing.
A semiconductor device that is characterized in that at least two materials to be bonded 20 and 70, 70 and 60, and/or 70 and 50, which are formed from at least one material selected from the group consisting of engineering plastics, ceramics and metals, are bonded with each other by means of a cured product 10 of an adhesive that contains (A) a thermosetting resin, (B) a specific thiol compound and (C) a latent curing agent.
Inventors:
ARAI FUMINORI (JP)
Application Number:
PCT/JP2016/057353
Publication Date:
September 15, 2016
Filing Date:
March 09, 2016
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C09J163/00; C09J11/06; C09J133/06; G02B7/02; H01L27/14; H01L31/02; H04N5/369
Domestic Patent References:
| WO2015080241A1 | 2015-06-04 | |||
| WO2015141347A1 | 2015-09-24 | |||
| WO2016027716A1 | 2016-02-25 |
Foreign References:
| JPH06211969A | 1994-08-02 | |||
| JP2000080153A | 2000-03-21 | |||
| JP2015059099A | 2015-03-30 |
Attorney, Agent or Firm:
WATARAI YUSUKE (JP)
Yuusuke Watarai (JP)
Yuusuke Watarai (JP)
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