SEMICONDUCTOR DEVICE AND IMAGING MODULE

Title:

SEMICONDUCTOR DEVICE AND IMAGING MODULE

Document Type and Number:

WIPO Patent Application WO/2015/107849

Kind Code:

A1

Abstract:

This semiconductor device is a semiconductor device (2) which is mounted on a device (1) and is provided with: a substrate (20) having a first surface (14); a terminal (13) that is formed on the first surface (14) of the substrate (20) and is connected to the device (1); a first wiring line (21) that is formed on the first surface (14) of the substrate (20) and is electrically connected with the terminal (13); and a dielectric layer (22) that covers at least a part of the first wiring line (21). The first surface (14) of the substrate (20) has a non-formation region (24) where the dielectric layer (22) is not formed, and the non-formation region (24) is continued from the position of the terminal (13) to an edge (20a) of the substrate (20).

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Inventors:

WADA HIDEYUKI (JP)

Application Number:

PCT/JP2014/084252

Publication Date:

July 23, 2015

Filing Date:

December 25, 2014

Export Citation:

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Assignee:

FUJIKURA LTD (JP)

International Classes:

H01L23/12; H01L21/60; H01L23/00; H01L27/14; H01L31/02; H01L31/10

Foreign References:

JP2010278040A	2010-12-09
JP2009212481A	2009-09-17
JP2009158862A	2009-07-16

Attorney, Agent or Firm:

SHIGA Masatake et al. (JP)
Masatake Shiga (JP)

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