Title:
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262199
Kind Code:
A1
Abstract:
A semiconductor device according to the present disclosure comprises: a layered plurality of substrates (100A, 200A); semiconductor elements (TR, AMP) formed on at least one of the plurality of substrates (100A, 200A); and protective elements (TF, TS) formed comprising a PN junction on at least one of the plurality of substrates (100A, 200A) and protecting the semiconductor elements (TR, AMP).
More Like This:
| WO/2021/059580 | SEMICONDUCTOR DEVICE |
| JP2012169532 | INTEGRATED CIRCUIT DEVICE AND ELECTRONIC APPARATUS |
| JP2019103125 | RF DEVICE |
Inventors:
OKAMOTO SHINTARO (JP)
Application Number:
PCT/JP2020/024008
Publication Date:
December 30, 2020
Filing Date:
June 18, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/04; H01L21/768; H01L21/8234; H01L23/522; H01L27/088; H01L27/146; H04N5/374
Domestic Patent References:
| WO2017038403A1 | 2017-03-09 | |||
| WO2017169883A1 | 2017-10-05 | |||
| WO2018070260A1 | 2018-04-19 |
Foreign References:
| JP2012502477A | 2012-01-26 | |||
| JP2003517216A | 2003-05-20 | |||
| JP2017152462A | 2017-08-31 | |||
| JP2007012864A | 2007-01-18 | |||
| JP2014123771A | 2014-07-03 | |||
| JP2012033878A | 2012-02-16 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: