Title:
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/190640
Kind Code:
A1
Abstract:
The present technology relates to a semiconductor device and an imaging device that make it possible to efficiently dissipate heat generated in a semiconductor package in which a resin is used. The present invention comprises a first substrate, a second substrate, a wiring layer positioned between the first and second substrates, and a slit that passes through the first substrate and reaches the wiring layer. An air gap is provided to each wiring element provided in the wiring layer. The present technology can be applied to, e.g., a semiconductor device in which a chip having an imaging element formed thereon and a chip that processes signals from the imaging element are stacked.
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Inventors:
TOZAWA KATSUNORI (JP)
Application Number:
PCT/JP2022/001491
Publication Date:
September 15, 2022
Filing Date:
January 18, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/00; H01L27/146; H04N5/225; H04N5/369
Foreign References:
| JPH1167769A | 1999-03-09 | |||
| JP2016181531A | 2016-10-13 | |||
| JP2002334967A | 2002-11-22 | |||
| JP2012033878A | 2012-02-16 | |||
| JP2020098901A | 2020-06-25 | |||
| JP2017188611A | 2017-10-12 | |||
| JP2012114370A | 2012-06-14 | |||
| US20040084726A1 | 2004-05-06 | |||
| JP2015061041A | 2015-03-30 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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