Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/114377
Kind Code:
A1
Abstract:
[Problem] To provide: a structure of a laminated semiconductor element producing an element shape which facilitates high integration, high-speed driving, reductions in power consumption and heat generation, reductions in size and weight, and easier incorporation in application products with respect to the laminated semiconductor element or the like, thereby enabling use in fields in which application has conventionally been difficult; and a method for manufacturing a semiconductor element or the like for realizing the same. [Solution] A part of a semiconductor-element side surface is shaped so as to be smooth and covered by an insulating film. The present invention is characterized in that the aforementioned side surface is exposed by a combination of an etching step and a dicing step or by an etching step only, whereby semiconductor elements are cut from a semiconductor wafer substrate.
Inventors:
SHIZUKUISHI MAKOTO (JP)
Application Number:
PCT/JP2016/051078
Publication Date:
July 21, 2016
Filing Date:
January 15, 2016
Export Citation:
Assignee:
SHIZUKUISHI MAKOTO (JP)
International Classes:
H01L27/146; G01T1/24; G01T7/00; H01L27/14; H01L27/144; H01L31/08
Foreign References:
| JP2000133822A | 2000-05-12 | |||
| JP2011205085A | 2011-10-13 | |||
| JP2006253402A | 2006-09-21 | |||
| JP2003139611A | 2003-05-14 |
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