Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING STEP OF REMOVING PAD ELECTRODE FOR INSPECTION
Document Type and Number:
WIPO Patent Application WO/2012/011207
Kind Code:
A1
Abstract:
First of all, a first interlayer insulating film (101) is formed on a semiconductor substrate (100) on which an element to be measured is formed. After that, a contact plug (206) that is electrically connected to the element to be measured and a first wiring line (102) that is electrically connected to the contact plug (206) are formed in the first interlayer insulating film (101). Next, a pad electrode for inspection (104A) that is composed of an organic conductive film is formed on the first interlayer insulating film (101) so as to be connected to the first wiring line (102). Following that, the electrical characteristics of the element to be measured are measured, while keeping a probe needle (107) in contact with the pad electrode for inspection (104A). After that, the pad electrode for inspection (104A) is removed.
Inventors:
FUJII, Masaaki (())
藤井政了 (())
YASUI, Takatoshi (())
藤井政了 (())
YASUI, Takatoshi (())
Application Number:
JP2011/001515
Publication Date:
January 26, 2012
Filing Date:
March 15, 2011
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
FUJII, Masaaki (())
藤井政了 (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
FUJII, Masaaki (())
藤井政了 (())
International Classes:
H01L21/66; G01R31/28; H01L21/3205; H01L23/52
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (Osaka-Marubeni Bldg, 5-7Hommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 53, 〒5410053, JP)
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Claims: