Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/185088
Kind Code:
A1
Abstract:
[Problem] To cool a plurality of semiconductor elements by means of a cooling medium in a semiconductor device, a semiconductor device manufacturing method, and an electronic apparatus.
[Solution] The problem is solved by means of a semiconductor device having: a first semiconductor element (22); a first substrate (25), which is provided on the first semiconductor element (22), and which is provided with a depressurized hollow (S); a cooling medium (C) contained in the hollow (S); a second semiconductor element (23) that is provided on the first substrate (25); and a heat dissipating member (30), which is thermally connected to the first substrate (25), and which is provided with a hole (30x) that is connected to the hollow (S).
Inventors:
TANIGUCHI JUN (JP)
SHIOGA TAKESHI (JP)
MIZUNO YOSHIHIRO (JP)
SHIOGA TAKESHI (JP)
MIZUNO YOSHIHIRO (JP)
Application Number:
PCT/JP2014/051524
Publication Date:
November 20, 2014
Filing Date:
January 24, 2014
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
H01L23/427; H05K7/20
Foreign References:
| JP2012089642A | 2012-05-10 | |||
| JP2010087461A | 2010-04-15 | |||
| JP2011145044A | 2011-07-28 | |||
| JP2012229909A | 2012-11-22 | |||
| JP3181382U | 2013-01-31 |
Attorney, Agent or Firm:
OKAMOTO, KEIZO (JP)
Keizo Okamoto (JP)
Keizo Okamoto (JP)
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