Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, IMAGING APPARATUS, AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2017/135062
Kind Code:
A1
Abstract:
The present technology pertains to: a semiconductor device that allows components to be mounted with a high degree of flatness at low cost; a manufacturing method; an imaging apparatus; and electronic equipment. This semiconductor device has: a core substrate; a multilayer wiring layer that is formed on the surface of the core substrate and has a plurality of conductive layers and a plurality of insulating layers; an opening that is formed in the multilayer wiring layer and that penetrates, among the insulating layers, at least the outermost insulating layer farthest from the core substrate; and a mounting element connected to, in the opening, a pad portion provided to a prescribed conductive layer located closer to the core substrate side than the outermost conductive layer farthest from the core substrate among the conductive layers. The present technology can be applied to an imaging apparatus.
Inventors:
HOGYOKU SUSUMU (JP)
Application Number:
PCT/JP2017/001852
Publication Date:
August 10, 2017
Filing Date:
January 20, 2017
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L23/12; H01L21/60; H01L27/146; H04N5/369; H05K3/46
Foreign References:
| JP2008305972A | 2008-12-18 | |||
| JP2015149325A | 2015-08-20 | |||
| JP2005252223A | 2005-09-15 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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