Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, LIGHT-ABSORBING LAYERED BODY, AND TEMPORARY-FIXING-USE LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2020/111193
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device manufacturing method comprising, in this order: a step for processing a semiconductor member that has been temporarily fixed to a support member via a temporary fixing material layer; and a step for separating the semiconductor member from the support member by irradiating a temporary-fixing-use layered body with incoherent light from the support member side. All or part of the temporary fixing material layer is a light-absorbing layer which absorbs light and generates heat. The transmittance of the support member with respect to the incoherent light is 90% or greater. The transmittance of the temporary fixing material layer with respect to the incoherent light is 3.1% or less.
Inventors:
NISHIDO KEISUKE (JP)
MIYAZAWA EMI (JP)
OOYAMA YASUYUKI (JP)
KAWAMORI TAKASHI (JP)
AKASU YUTA (JP)
SHIRASAKA TOSHIAKI (JP)
SUZUKI NAOYA (JP)
HAYASAKA TSUYOSHI (JP)
MIYAZAWA EMI (JP)
OOYAMA YASUYUKI (JP)
KAWAMORI TAKASHI (JP)
AKASU YUTA (JP)
SHIRASAKA TOSHIAKI (JP)
SUZUKI NAOYA (JP)
HAYASAKA TSUYOSHI (JP)
Application Number:
PCT/JP2019/046636
Publication Date:
June 04, 2020
Filing Date:
November 28, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/02; H01L21/301
Foreign References:
| JP2016048729A | 2016-04-07 | |||
| US20060286768A1 | 2006-12-21 | |||
| JP2013534721A | 2013-09-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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