Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND POWER CONVERTER
Document Type and Number:
WIPO Patent Application WO/2022/054560
Kind Code:
A1
Abstract:
This semiconductor device (SD) is provided with a semiconductor element (5), a metal member (1), a socket (ST), and an encapsulating resin (11). The metal member (1) has a semiconductor element (5) mounted thereon. The socket (ST) is electrically connected to the metal member (1). The encapsulating resin (11) encapsulates the semiconductor element (5) and the metal member (1). In the direction of overlap between the semiconductor element (5) and the metal member (1), the encapsulating resin (11) includes a first surface (S1) and a second surface (S2). The socket (ST) is arranged so as to be exposed from the second surface (S2) of the encapsulating resin (11). In the direction of overlap between the semiconductor element (5) and the metal member (1), the socket (ST) is arranged to the inside of the outer edge (11a) of the encapsulating resin (11).
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| JPS6119150 | ELECTRONIC PART |
Inventors:
IWAI TAKAMASA (JP)
FUJINO JUNJI (JP)
HASHIMOTO TOMOAKI (JP)
GOTO YOICHI (JP)
SUZUKI YUICHIRO (JP)
FUJINO JUNJI (JP)
HASHIMOTO TOMOAKI (JP)
GOTO YOICHI (JP)
SUZUKI YUICHIRO (JP)
Application Number:
PCT/JP2021/030921
Publication Date:
March 17, 2022
Filing Date:
August 24, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| WO2018235197A1 | 2018-12-27 |
Foreign References:
| JP2010129868A | 2010-06-10 | |||
| JP2011165836A | 2011-08-25 | |||
| JP2001196532A | 2001-07-19 | |||
| JPH0894244A | 1996-04-12 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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