Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/106846
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device manufacturing method comprising: a formation step for forming, on a supporting member, a temporary fixation material layer that generates heat upon absorption of a light beam; a temporary fixation step for placing a semiconductor member on the temporary fixation material layer and temporarily fixing the semiconductor member to the supporting member via a hardened product of the temporary fixation material layer; a processing step for processing the semiconductor member that has been temporarily fixed to the supporting member; and a separation step for irradiating the hardened product of the temporary fixation material layer with a light beam so as to separate the processed semiconductor member from the supporting member.
Inventors:
MIYAZAWA EMI (JP)
KAWAMORI TAKASHI (JP)
SUKATA SHINICHIROU (JP)
KAWAMORI TAKASHI (JP)
SUKATA SHINICHIROU (JP)
Application Number:
PCT/JP2017/043363
Publication Date:
June 06, 2019
Filing Date:
December 01, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/683
Foreign References:
| JP2005159155A | 2005-06-16 | |||
| JP2012206266A | 2012-10-25 | |||
| JP2006080142A | 2006-03-23 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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