Title:
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2014/069213
Kind Code:
A1
Abstract:
This method for manufacturing a semiconductor device comprises: a step for forming a first groove (51) that extends in a prescribed direction in a first insulating layer (25) on a semiconductor substrate (1); a step for forming an electrically conductive embedded layer (127) in the first groove; a step for forming a first and a second plug (27b, 27c) by dividing the embedded layer in a prescribed direction; a step for forming a first conductive film (55), having lower resistance than the embedded layer, on the exposed side surfaces of the first and second plugs; a step for embedding a second insulating layer (29) in a second groove that is located between the first conductive films of the first and second plugs; and a step for forming a second conductive film (37), having lower resistance than the embedded layer, on the exposed top surfaces of the first and second plugs.
Inventors:
YOKOMICHI MASAHIRO (JP)
Application Number:
PCT/JP2013/077698
Publication Date:
May 08, 2014
Filing Date:
October 11, 2013
Export Citation:
Assignee:
PS4 LUXCO SARL (LU)
YOKOMICHI MASAHIRO (JP)
YOKOMICHI MASAHIRO (JP)
International Classes:
H01L21/768; H01L21/8242; H01L23/522; H01L27/108
Foreign References:
| JP2012190910A | 2012-10-04 | |||
| JP2012019035A | 2012-01-26 | |||
| JP2006269800A | 2006-10-05 | |||
| JP2012222088A | 2012-11-12 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
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