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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2014/192199
Kind Code:
A1
Abstract:
A semiconductor device (30) is provided with: a backside illumination solid-state imaging element (31), which has a photoelectric conversion unit (21) disposed in a semiconductor substrate (20), and a control unit (22) which is formed on one surface of the semiconductor substrate (20) and includes control elements, the other surface of the semiconductor substrate (20) acting as a light receiving surface; and a cooling element (17) which is disposed on a retaining substrate (10). The top of the control unit in the semiconductor substrate (20) and the top of the cooling element (17) in the retaining substrate (10) are directly bonded so as to face each other.

Inventors:
FUKUDA SHUGO
YAMASHITA YUKIHIRO
Application Number:
PCT/JP2014/000774
Publication Date:
December 04, 2014
Filing Date:
February 14, 2014
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L27/14; H01L23/38; H01L35/32; H04N5/361; H04N5/369; H04N5/374
Foreign References:
JP2004134578A2004-04-30
JP2008182878A2008-08-07
JP2008166725A2008-07-17
JP2006066880A2006-03-09
US20110089517A12011-04-21
JP2006201044A2006-08-03
JP2012234968A2012-11-29
JP2014036041A2014-02-24
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
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