Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/079243
Kind Code:
A1
Abstract:
The present art relates to: a semiconductor device in which it is possible to suppress a reduction in bonding strength and to prevent electrical connection defects or separation when formed by affixing two substrates; a manufacturing method; and a solid-state imaging device. Provided is a semiconductor device including: a first substrate that has a first electrode formed from a metal; and a second substrate that is affixed to the first substrate, and has a second electrode formed from a metal. Acute-angled recesses and projections are formed on the side surfaces of a groove in which the first electrode is formed, and on the side surfaces of a groove in which the second electrode metal-bonded to the first electrode is formed. The present art is applicable to, for example, a solid-state imaging device such as a CMOS image sensor.

Inventors:
HIRATA AKIKO (JP)
KIMURA TADAYUKI (JP)
MIYOSHI YASUFUMI (JP)
HIRAMATSU KATSUNORI (JP)
Application Number:
PCT/JP2017/036649
Publication Date:
May 03, 2018
Filing Date:
October 10, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/02; H01L21/768; H01L23/522; H01L27/00
Foreign References:
JP2012244101A2012-12-10
JP2016181531A2016-10-13
JP2015525480A2015-09-03
JP2012124484A2012-06-28
JP2013165099A2013-08-22
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Download PDF: