Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/103855
Kind Code:
A1
Abstract:
A semiconductor device (1) equipped with a circuit board (10) on which multiple connection pads (13) are formed, a first semiconductor chip (20) that is mounted on the circuit board (10), a second semiconductor chip (30) that is laminated on the first semiconductor chip (20) and has multiple electrodes (31), reinforcement plates (40) that are laminated on the second semiconductor chip (30), and multiple wires that electrically connect the multiple connection pads (13) and the multiple electrodes (31) together, wherein the second semiconductor chip (30) has a laminated area (32) that overlaps with the first semiconductor chip (20) and overhang areas (33) that overhang from the first semiconductor chip (20), the electrodes (31) are formed in the overhang areas (33), and the reinforcement plates (40) are laminated on the second semiconductor chip (30) so as to straddle the laminated area (32) and the respective overhang areas (33) of the second semiconductor chip (30).
Inventors:
TOMOHIRO ATSUSHI (JP)
Application Number:
PCT/JP2013/084037
Publication Date:
July 03, 2014
Filing Date:
December 19, 2013
Export Citation:
Assignee:
PS4 LUXCO SARL (LU)
TOMOHIRO ATSUSHI (JP)
TOMOHIRO ATSUSHI (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2011113136A1 | 2011-09-22 |
Foreign References:
| JP2007142128A | 2007-06-07 | |||
| JP2006216776A | 2006-08-17 |
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
Noriyasu Ikeda (JP)
Noriyasu Ikeda (JP)
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