Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/174198
Kind Code:
A1
Abstract:
[Problem] To obtain a semiconductor device and a manufacturing method therefor whereby a problem in which a resin does not fill a narrow gap between a resin substrate and an electrical component provided on a control-circuit substrate is prevented, inhibiting crack formation in said electrical component and improving electrical reliability. [Solution] This semiconductor device includes a resin substrate (10) on which an electrical component (11) is mounted and a sealing resin (7) that seals said resin substrate (10). The resin substrate (10) is provided with a through-hole (13) that connects to a space (15) between the electrical component (11) and the resin substrate (10) underneath said electrical component (11).
Inventors:
YAMAMOTO KEI (JP)
ROKUBUICHI HODAKA (JP)
KITAI KIYOFUMI (JP)
ROKUBUICHI HODAKA (JP)
KITAI KIYOFUMI (JP)
Application Number:
PCT/JP2015/061661
Publication Date:
November 19, 2015
Filing Date:
April 16, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/28; H01L23/12; H01L23/29
Foreign References:
| JP2001358263A | 2001-12-26 | |||
| JPH0946072A | 1997-02-14 | |||
| JPH09214071A | 1997-08-15 | |||
| JPH10178151A | 1998-06-30 | |||
| JP2001217363A | 2001-08-10 | |||
| JP2005191257A | 2005-07-14 | |||
| JP2012256803A | 2012-12-27 |
Attorney, Agent or Firm:
INABA, Tadahiko et al. (JP)
Tadahiko Inaba (JP)
Tadahiko Inaba (JP)
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