Title:
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2018/163599
Kind Code:
A1
Abstract:
Obtained is a semiconductor device in which occurrence of chipping in a thin semiconductor element during conveyance is suppressed. The semiconductor device is provided with: a semiconductor element (1) having a front surface electrode (2) on the front surface side thereof and having a rear surface electrode (3) on the rear surface side thereof; a metallic member (4, 8) which has a thickness larger than the thickness of the semiconductor element (1) and which is formed on at least either the front surface electrode (2) or the rear surface electrode (3); and a resin member (5) from which a part of the front surface of the semiconductor element (1) is exposed and which surrounds the periphery of the metallic member (4, 8) by being in contact with a side surface of the metallic member (4, 8).
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Inventors:
YOKOYAMA YOSHINORI (JP)
FUJITA JUN (JP)
SHINOHARA TOSHIAKI (JP)
KOBAYASHI HIROSHI (JP)
FUJITA JUN (JP)
SHINOHARA TOSHIAKI (JP)
KOBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2018/000848
Publication Date:
September 13, 2018
Filing Date:
January 15, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/56; H01L21/50; H01L23/29; H01L23/31
Foreign References:
| JPH09298211A | 1997-11-18 | |||
| JPS54126577U | 1979-09-04 | |||
| JPS54177272U | 1979-12-14 | |||
| JP2001352066A | 2001-12-21 | |||
| JP2000058717A | 2000-02-25 | |||
| JPS56124265A | 1981-09-29 | |||
| JP2015220382A | 2015-12-07 | |||
| JP2011061116A | 2011-03-24 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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