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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/143784
Kind Code:
A3
Abstract:
A semiconductor device includes a first semiconductor element (10); a first thick plate portion (31) that is electrically connected to an electrode (11) on a lower surface side of the first semiconductor element, and is formed by a conductor; a second semiconductor element (20) that is arranged such that a main surface of the second semiconductor element faces a main surface of the first semiconductor element; a second thick plate portion (32) that is electrically connected to an electrode (21) on a lower surface side of the second semiconductor element, and is formed by a conductor; a third thick plate portion (41) that is electrically connected to an electrode (12) on an upper surface side of the first semiconductor element, and is formed by a conductor; a fourth thick plate portion (42) that is electrically connected to an electrode (22) on an upper surface side of the second semiconductor element, and is formed by a conductor; a first thin plate portion (33, 34) that is provided on the second thick plate portion, is formed by a conductor, and is thinner than the second thick plate portion; and a second thin plate portion (43, 44) that is provided on the third thick plate portion, is formed by a conductor, and is thinner than the third thick plate portion. The first thin plate portion and the second thin plate portion are fixed together and electrically connected.

Inventors:
KADOGUCHI TAKUYA (JP)
IWASAKI SHINGO (JP)
KAWASHIMA TAKANORI (JP)
OKUMURA TOMOMI (JP)
NISHIHATA MASAYOSHI (JP)
Application Number:
PCT/IB2012/000773
Publication Date:
March 07, 2013
Filing Date:
April 18, 2012
Export Citation:
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Assignee:
TOYOTA MOTOR CO LTD (JP)
DENSO CORP (JP)
KADOGUCHI TAKUYA (JP)
IWASAKI SHINGO (JP)
KAWASHIMA TAKANORI (JP)
OKUMURA TOMOMI (JP)
NISHIHATA MASAYOSHI (JP)
International Classes:
H01L23/495
Foreign References:
EP2028692A12009-02-25
EP1148547A22001-10-24
US20070176266A12007-08-02
Other References:
See also references of EP 2700095A2
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