Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/167745
Kind Code:
A1
Abstract:
This semiconductor device is characterized in that: the semiconductor device is provided with a mounting substrate, an adhesive applied to the mounting substrate, and a device having the lower surface thereof bonded to the mounting substrate using the adhesive; and a side surface upper portion of the device has a smaller surface roughness than a side surface lower portion of the device.
Inventors:
YOSHIDA KAZUO (JP)
NEGISHI MASATO (JP)
NEGISHI MASATO (JP)
Application Number:
PCT/JP2013/077979
Publication Date:
October 16, 2014
Filing Date:
October 15, 2013
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/52; H01L21/301
Foreign References:
| JP2007109822A | 2007-04-26 | |||
| JP2011210925A | 2011-10-20 | |||
| JP2012079800A | 2012-04-19 | |||
| JP2012004478A | 2012-01-05 |
Other References:
See also references of EP 2985785A4
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
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