SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Title:

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2015/145651

Kind Code:

A1

Abstract:

According to an embodiment of the present invention, in a semiconductor device manufacturing method, a lead frame is prepared, said lead frame having formed therein a groove section such that the lower surfaces of a first lead and a second lead, which are connected between device regions adjacent to each other, are communicated with each other. After a part of a connecting section between the first and second leads is cut using a first blade, metal waste formed in the groove section is removed. After removing the metal waste, a metal film is formed on exposed surfaces of the first and second leads by means of a plating method, then, the remaining part of the connecting section of the first and second leads is cut using a second blade. At that time, cutting is performed such that the second blade is not brought into contact with the groove section.

Inventors:

MAKINO YASUTOMO (JP)

Application Number:

PCT/JP2014/058815

Publication Date:

October 01, 2015

Filing Date:

March 27, 2014

Export Citation:

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Assignee:

RENESAS ELECTRONICS CORP (JP)

International Classes:

H01L21/50; H01L23/28; H01L23/50

Foreign References:

JP2014007287A	2014-01-16
JP2006179760A	2006-07-06
JP2011091194A	2011-05-06
US6608366B1	2003-08-19
JP2000294719A	2000-10-20
JP2003019240A	2003-01-21
JP2008112961A	2008-05-15
JP2005093559A	2005-04-07

Other References: