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Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/193760
Kind Code:
A1
Abstract:
A semiconductor device comprising an assembly structure in which a semiconductor element (1) is mounted on a laminated substrate. The semiconductor element (1) and an electrode pattern (3) on the laminated substrate are bonded by means of a bonding layer. The bonding layer comprises a solder material which includes metal fibers and in which gaps between the metal fibers are filled with solder. The metal fibers (20) have mutually contacting points. The assembly structure may include a heatsink (5) on which the laminated substrate is mounted.

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Inventors:
SAITO TAKASHI (JP)
TANIGUCHI KATSUMI (JP)
MOCHIZUKI EIJI (JP)
Application Number:
PCT/JP2018/010087
Publication Date:
October 25, 2018
Filing Date:
March 14, 2018
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L21/52; B23K1/00; B23K35/14; B23K35/26; H01L23/373; C22C12/00; C22C13/00; C22C13/02
Foreign References:
JP2004174522A2004-06-24
JP2002301588A2002-10-15
JP2008004651A2008-01-10
JP2008153470A2008-07-03
JP2014086607A2014-05-12
JP2010179336A2010-08-19
Attorney, Agent or Firm:
SAKAI, Akinori (JP)
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