Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/107002
Kind Code:
A1
Abstract:
The present invention improves soldering strength even when a pad is miniaturized. This semiconductor device is provided with a pad, a diffusion layer, and a melt layer. The pad provided in the semiconductor device includes recesses in the surface thereof, and is subjected to soldering. The diffusion layer provided in the semiconductor device is made of metal that is disposed in the recesses and, when soldering is performed, diffuses into the solder and remains on the surface of the pad. The melt layer provided in the semiconductor device is made of metal that is disposed adjacent to the diffusion layer, and when soldering is performed, diffuses into the solder and melts.
Inventors:
NAKAMURA TAKUYA (JP)
Application Number:
PCT/JP2018/039008
Publication Date:
June 06, 2019
Filing Date:
October 19, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522; H01L27/146
Foreign References:
| JP2011198796A | 2011-10-06 | |||
| JP2017079281A | 2017-04-27 | |||
| JP2011054670A | 2011-03-17 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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