Title:
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/053146
Kind Code:
A1
Abstract:
A semiconductor device manufacturing device (10) comprises a wafer holding device (12) that holds one or more chips (100) adhesively held on a surface of a dicing tape (120) along with the dicing tape (120), a pickup head (14) that picks up a target chip (100), an energy emission device (16) that emits energy toward the target chip (100) from a rear surface side of the dicing tape (120) to reduce the adhesive strength of the dicing tape (120), a temperature sensor (44) that detects the temperature of an area irradiated by the energy, and a controller (22). The controller (22) controls the driving of the energy emission device (16) on the basis of the detected temperature by the temperature sensor (44).
Inventors:
SEYAMA KOHEI (JP)
NOMURA KATSUTOSHI (JP)
NOMURA KATSUTOSHI (JP)
Application Number:
PCT/JP2023/014709
Publication Date:
March 14, 2024
Filing Date:
April 11, 2023
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/52; H01L21/301; H01L21/67
Domestic Patent References:
| WO2021100591A1 | 2021-05-27 |
Foreign References:
| JP2021153176A | 2021-09-30 | |||
| JP2020080382A | 2020-05-28 | |||
| JP2019121760A | 2019-07-22 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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