Title:
SEMICONDUCTOR DEVICE, METAL ELECTRODE MEMBER AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/159505
Kind Code:
A1
Abstract:
In this invention, an open end (1a) of a main body cylinder portion (1) of a cylindrical contact member (10) is joined via a solder (25) onto a conductive plate (22) on an insulated base board. A portion on the other open end (1b) side of the main body cylinder portion (1) of the cylindrical contact member (10) is inserted into a cavity portion (12) of a hollow cylindrical external electrode terminal (11) from an open end (11e) at an end portion (11a) of the external electrode terminal (11). The other end portion (11b) of the external electrode terminal (11) is divided into a plurality of branch portions through cuts provided in a through-hole insertion portion (11c). At each of the branch portions of the through-hole insertion portion (11c) of the external electrode terminal (11), the cylinder surface on the outer side has an arc shape. At each of the branch portions (11d) of the through-hole insertion portion (11c), a pressure is applied by an auxiliary wedge (14) in the direction from the interior to the exterior of the external electrode terminal (11). In this manner, assembly defects accompanying the connection of the external electrode terminal (11) to another member can be eliminated.
Inventors:
ADACHI KAZUYA (JP)
Application Number:
PCT/JP2017/009296
Publication Date:
September 21, 2017
Filing Date:
March 08, 2017
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01R12/58; H01L23/12; H01L23/48; H01R4/60; H05K1/18
Foreign References:
| JP2004349632A | 2004-12-09 | |||
| JP2011150833A | 2011-08-04 |
Attorney, Agent or Firm:
SAKAI, Akinori (JP)
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