Title:
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/123518
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a semiconductor device, the method including: a step for pressure-bonding a first member having a connecting portion and a second member having a connecting portion at a temperature lower than the melting point of the connecting portion of the first member and the melting point of the connecting portion of the second member by using a thermosetting adhesive to thereby obtain a temporarily pressure-bonded body in which the connecting portion of the first member and the connecting portion of the second member are disposed facing each other; a step for obtaining a pressure-bonded body by sandwiching the temporarily pressure-bonded body between a pair of the pressing members disposed facing each other and by pressurizing the same while heating to a temperature higher than the melting point of at least one among the connecting portion of the first member and the connecting portion of the second member; and a step for further heating the pressure-bonded body in a pressurized atmosphere. The first member is a semiconductor chip or a semiconductor wafer, and the second member is a wiring circuit board, a semiconductor chip or a semiconductor wafer.
Inventors:
HONDA KAZUTAKA (JP)
YANAGITA YUUKI (JP)
UENO KEIKO (JP)
YANAGITA YUUKI (JP)
UENO KEIKO (JP)
Application Number:
PCT/JP2017/045333
Publication Date:
June 27, 2019
Filing Date:
December 18, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/60; C09J5/06; C09J7/00; C09J201/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2011007531A1 | 2011-01-20 | |||
| WO2016148121A1 | 2016-09-22 |
Foreign References:
| JP2014107355A | 2014-06-09 | |||
| JP2016201418A | 2016-12-01 | |||
| JP2013168536A | 2013-08-29 | |||
| JP2017162927A | 2017-09-14 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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