Title:
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR IDENTIFYING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188115
Kind Code:
A1
Abstract:
A semiconductor device (100) according to the present disclosure comprises: a semiconductor substrate (20); semiconductor layers (21, 22, 23, 24, 25, 27) formed on the semiconductor substrate (20); identification pattern regions (15, 16) provided at preset sections on the semiconductor substrate (20); and a needle-like structure (40) formed at random positions in the identification pattern regions (15, 16), or a dome-like structure (41) in which the needle-like structure (40) is covered with an insulating film (31) composed of SiO2.
Inventors:
SHIRATAKI HODAKA (JP)
ONOE KAZUYUKI (JP)
ONOE KAZUYUKI (JP)
Application Number:
PCT/JP2022/016015
Publication Date:
October 05, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/227; G06T7/00; H01L21/02; H01L23/00
Domestic Patent References:
| WO2020240644A1 | 2020-12-03 | |||
| WO2016035774A1 | 2016-03-10 |
Foreign References:
| JP2006190840A | 2006-07-20 | |||
| JP2020145391A | 2020-09-10 | |||
| US20190035746A1 | 2019-01-31 | |||
| JP2015233093A | 2015-12-24 | |||
| JP2014146722A | 2014-08-14 | |||
| JP2011509449A | 2011-03-24 | |||
| JP2009200341A | 2009-09-03 | |||
| JP2008133495A | 2008-06-12 | |||
| JP2001160655A | 2001-06-12 | |||
| JP2000235636A | 2000-08-29 | |||
| JPH06275911A | 1994-09-30 | |||
| JPH0685390A | 1994-03-25 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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