Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/032529
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bonding. In the semiconductor device, the water content in the patterned film-like photosensitive adhesive right before the thermal compression bonding is not more than 1.0% by weight.
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Inventors:
KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
Application Number:
PCT/JP2009/061596
Publication Date:
March 25, 2010
Filing Date:
June 25, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
International Classes:
H01L21/52; C09J4/00; C09J7/00; C09J11/06; C09J163/00; C09J179/04; C09J201/00
Domestic Patent References:
WO1997002595A1 | 1997-01-23 |
Foreign References:
JP2008088403A | 2008-04-17 | |||
JPH05152355A | 1993-06-18 | |||
JP2009164574A | 2009-07-23 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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