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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/032529
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bonding.  In the semiconductor device, the water content in the patterned film-like photosensitive adhesive right before the thermal compression bonding is not more than 1.0% by weight.

Inventors:
KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
Application Number:
PCT/JP2009/061596
Publication Date:
March 25, 2010
Filing Date:
June 25, 2009
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
KAWAMORI TAKASHI (JP)
MITSUKURA KAZUYUKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
International Classes:
H01L21/52; C09J4/00; C09J7/00; C09J11/06; C09J163/00; C09J179/04; C09J201/00
Domestic Patent References:
WO1997002595A11997-01-23
Foreign References:
JP2008088403A2008-04-17
JPH05152355A1993-06-18
JP2009164574A2009-07-23
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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