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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/018842
Kind Code:
A1
Abstract:
Provided are: a semiconductor device which is capable of reducing the processes or reducing the area of a variable resistance element as much as possible; and a method for manufacturing the semiconductor device. A semiconductor device, which comprises two or more variable resistance elements (100) inside a multilayer wiring layer on a semiconductor substrate (101), and wherein: each variable resistance element (100) has a configuration in which a variable resistance layer (111) having a variable resistance is interposed between a lower electrode (105) and an upper electrode (112); a wiring line in a predetermined wiring layer in the multilayer wiring layer also serves as the lower electrode (105); and the upper electrode (112) is formed as a line that extends in one direction and also serves as an upper electrode of another variable resistance element that is adjacent to the variable resistance element (100) in the above-mentioned one direction.

Inventors:
SAKAMOTO TOSHITSUGU (JP)
TADA MUNEHIRO (JP)
MIYAMURA MAKOTO (JP)
Application Number:
PCT/JP2012/069627
Publication Date:
February 07, 2013
Filing Date:
August 01, 2012
Export Citation:
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Assignee:
NEC CORP (JP)
SAKAMOTO TOSHITSUGU (JP)
TADA MUNEHIRO (JP)
MIYAMURA MAKOTO (JP)
International Classes:
H01L27/105; H01L45/00; H01L49/00
Domestic Patent References:
WO2009001534A12008-12-31
WO2010079829A12010-07-15
Foreign References:
JP2002198496A2002-07-12
JP2007149800A2007-06-14
Attorney, Agent or Firm:
KATO, Asamichi (JP)
Asamichi Kato (JP)
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Claims: