Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/168012
Kind Code:
A1
Abstract:
A semiconductor device provided with: a first magnetic layer made of a soft magnetic material and disposed on a flat substrate surface; and a second magnetic layer disposed above the first magnetic layer and magnetically bonded to the first magnetic layer with magnetostatic coupling or exchange coupling, a conductive thin-film layer (11) being formed in an area corresponding to at least a portion of the top surface of the first magnetic layer.
Inventors:
HONJOU HIROAKI (JP)
FUKAMI SHUNSUKE (JP)
KINOSHITA KEIZO (JP)
OHNO HIDEO (JP)
FUKAMI SHUNSUKE (JP)
KINOSHITA KEIZO (JP)
OHNO HIDEO (JP)
Application Number:
PCT/JP2014/058703
Publication Date:
October 16, 2014
Filing Date:
March 19, 2014
Export Citation:
Assignee:
NEC CORP (JP)
UNIV TOHOKU (JP)
UNIV TOHOKU (JP)
International Classes:
H01L27/105; H01L21/8246; H01L43/08; H01L43/12
Domestic Patent References:
| WO2009122990A1 | 2009-10-08 | |||
| WO2009001706A1 | 2008-12-31 |
Foreign References:
| JP2007027196A | 2007-02-01 | |||
| JP2008034857A | 2008-02-14 |
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
Noriyasu Ikeda (JP)
Noriyasu Ikeda (JP)
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