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Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/182234
Kind Code:
A1
Abstract:
A semiconductor device (1) is provided with: a semiconductor substrate (50); a plurality of first electrode layers (10) that are formed on the semiconductor substrate (50) by being separated from each other; wiring (30) that is formed between a first electrode layer (10) and a first electrode layer (10), which are adjacent to each other; an insulating protection film (60) with which the wiring (30) and the semiconductor substrate (50) between the first electrode layer (10) and the first electrode layer (10), which are adjacent to each other, are covered; and a plurality of second electrode layers (20) which are formed on the first electrode layers (10), respectively. End sections (61) of the protection film (60) are covered with the second electrode layers (20), and the protection film (60) is exposed between the second electrode layer (20) and the second electrode layer (20), which are adjacent to each other.

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Inventors:
NARITA KATSUTOSHI (JP)
Application Number:
PCT/JP2015/059725
Publication Date:
December 03, 2015
Filing Date:
March 27, 2015
Export Citation:
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Assignee:
TOYOTA MOTOR CO LTD (JP)
International Classes:
H01L21/3205; H01L21/60; H01L21/768; H01L23/522
Foreign References:
JP2012019121A2012-01-26
JP2012119444A2012-06-21
JP2005039017A2005-02-10
JP2011253944A2011-12-15
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
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