Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/129109
Kind Code:
A1
Abstract:
This semiconductor device has: a plurality of wiring lines (WR11) formed above a semiconductor substrate, said wiring lines being formed in a same layer; and a plurality of wiring lines (WR12) formed in the same layer with the wiring lines (WR11). The wiring lines (WR11) extend in the X axis direction in a plan view, and are disposed at a pitch (PT11) in the Y axis direction intersecting the X axis direction, and the wiring lines (WR12) extend in the X axis direction in the plan view, and are disposed at a pitch (PT12) in the Y axis direction. The wiring lines (WR11) are electrically connected to the wiring lines (WR12), respectively, and the pitch (PT11) is smaller than the pitch (PT12).
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Inventors:
SEKIKAWA HIROAKI (JP)
Application Number:
PCT/JP2015/053997
Publication Date:
August 18, 2016
Filing Date:
February 13, 2015
Export Citation:
Assignee:
RENESAS ELECTRONICS CORP (JP)
International Classes:
H01L21/3205; H01L27/14; H01L21/768; H01L21/82; H01L23/522; H04N5/369
Foreign References:
| JP2007317870A | 2007-12-06 | |||
| JP2003273342A | 2003-09-26 | |||
| JP2001036051A | 2001-02-09 | |||
| JP2006294707A | 2006-10-26 | |||
| JPH03174770A | 1991-07-29 | |||
| JP2010098095A | 2010-04-30 | |||
| JP2006059847A | 2006-03-02 | |||
| JP2001306641A | 2001-11-02 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
Patent business corporation Tsutsui international patent firm (JP)
Patent business corporation Tsutsui international patent firm (JP)
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