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Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/208941
Kind Code:
A1
Abstract:
A semiconductor device provided with an insulating substrate (5) having conductor patterns (52a, 52b) on both sides of an insulating base material (51), a semiconductor element (1) mounted on one of the conductor patterns, and an electrode terminal (3) bonded to the one conductor pattern by means of a hard brazing material (10), wherein the electrode terminal has a larger heat capacity per unit area than the heat capacity per unit area in the one conductor pattern.

Inventors:
YONEDA YUTAKA (JP)
KIKUCHI MASAO (JP)
Application Number:
PCT/JP2017/019414
Publication Date:
December 07, 2017
Filing Date:
May 24, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/48
Foreign References:
JP2009105266A2009-05-14
JP2002100848A2002-04-05
JPH08162595A1996-06-21
JP2012252935A2012-12-20
JP2007227893A2007-09-06
JPS6420633A1989-01-24
JPS5978787A1984-05-07
JPS59177951A1984-10-08
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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