Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/159329
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a primary molded body (10) formed by having a semiconductor chip (12) that has a detection unit for detecting physical quantities, and a primary molded resin (13) formed of a resin material; a housing component (20), in which an insertion hole (21) for inserting the primary molded body is formed; and a secondary molded resin (30), which is formed of a resin material, and which integrally covers a region exposed from the insertion hole, said region being a part of the surface of the primary molded body, and a housing component surface region including a region surrounding the insertion hole. A primary molded body portion including the semiconductor chip is inserted into the insertion hole.
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Inventors:
IZUMI RYOSUKE (JP)
YOSHIDA NORIHITO (JP)
YOSHIDA NORIHITO (JP)
Application Number:
PCT/JP2018/005509
Publication Date:
September 07, 2018
Filing Date:
February 16, 2018
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/29; B29C33/12; B29C39/10; B29C39/24; H01L21/56; H01L23/31
Foreign References:
JP2004125767A | 2004-04-22 | |||
JP2010071724A | 2010-04-02 | |||
JP2014103361A | 2014-06-05 | |||
JP2005007872A | 2005-01-13 | |||
JP2012174882A | 2012-09-10 | |||
JP2013096970A | 2013-05-20 | |||
JP2014132626A | 2014-07-17 | |||
JP2004281428A | 2004-10-07 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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